Boasting excellent chemical inertness, ultra-low metal ion leaching, superior inner wall smoothness and outstanding stability over a wide temperature range, Ultra-Clean PFA Tube serves as an essential core pipeline component for semiconductor photoresist transfer systems.
As chip manufacturing processes evolve toward more advanced nodes, fabrication fabs have raised stricter standards for the purity and particle control of photoresist delivery pipelines. As a vital fluid passage connecting storage tanks, pumps, valves and other components, Ultra-Clean PFA Tube must withstand long-term corrosion from strong organic solvents in photoresists. Meanwhile, it is required to deliver ultra-low metal ion leaching and superior particle control performance, so as to minimize photoresist contamination and ensure the yield of products manufactured by advanced processes.
For a long time, the domestic market for semiconductor-grade Ultra-Clean PFA Tube has been highly dependent on imports. Particularly for the production of advanced logic and memory chips, high-end products are still dominated by a small number of international manufacturers. Faced with technical bottlenecks in core fluid pipeline materials for semiconductors, BSL has continuously made breakthroughs in key processes including precision extrusion molding of high-purity PFA, steadily improved the control capability of metal leaching, and upgraded full-process clean manufacturing technologies. In addition, BSL is accelerating product verification and on-site application at mainstream fabs and semiconductor equipment suppliers. Our product portfolio features high batch consistency, superior chemical resistance and ultra-high purity, fully meeting the rigorous requirements of photoresist transfer systems for advanced processes. It provides solid support for the independent controllability and sustainable development of key semiconductor consumables.
01 Chemical Resistance
BSL adopts high-purity PFA raw materials. Innovative processes improve the density and uniform molecular structure of the tubes, reduce micropores and weld defects, and effectively block penetration channels for corrosive media, which greatly enhances the overall corrosion resistance and anti-swelling performance. When in long-term contact with common organic solvents for photoresists (such as PGMEA and Cyclohexanone), as well as chemicals widely used in semiconductor wet processes including sulfuric acid and hydrofluoric acid, the tubes show no swelling, cracking or mass loss, delivering excellent chemical resistance.
Test results show that after 168 hours of immersion in 37% hydrochloric acid at 85℃, BSL Ultra-Clean PFA Tube has no obvious changes in appearance and dimensions, and the total leachables remain stable. Its overall chemical resistance has reached the world’s advanced level.
02 Low Metal Ion Leaching
Manufactured with high-precision production equipment, BSL Ultra-Clean PFA Tube maintains ultra-high purity. In compliance with the Group Standard for Semiconductor-Grade Perfluoroalkoxy (PFA) Tubes (hereinafter referred to as the Standard), the leaching levels of metal ions such as aluminum, calcium, chromium, iron and sodium are all controlled below the limits specified in the Standard. Especially for critical impurities including sodium, iron and calcium, our product delivers performance equivalent to or even better than international competing products, ensuring fluid purity from pipelines to wafers throughout the whole process.
03 Low TOC and Particulate Leaching
The tubes undergo ultrasonic cleaning and multi-stage ultrapure water flushing, which drastically reduces organic residues and loose particulates on the inner wall. The Standard stipulates that the total organic carbon (TOC) content shall not exceed 2000 μg/m², while the actual measured TOC value of BSL products is controlled within 60% of the standard limit.
In addition, particulate leaching fully complies with SEMI Standards. In particle-sensitive photolithography processes such as photoresist coating and development, particle detachment from the tube inner wall is kept to a minimum, avoiding wafer surface scratches and short-circuit defects.
04 Smooth Inner Surface
Adopting high-precision extrusion dies and stable process parameters, the average surface roughness (Ra) of the tube inner wall of BSL products is steadily controlled at ≤0.25 μm. Atomic Force Microscope (AFM) tests verify that the inner wall is smooth and free of microcracks. This effectively suppresses fluid turbulence and reduces particle adhesion and chemical residue accumulation.
Independently developed BSL Ultra-Clean PFA series products fully satisfy the extreme demands of advanced semiconductor processes for photoresist transfer. They are applicable to harsh working scenarios requiring high cleanliness, strong corrosion resistance and high precision, ensuring stable operation of fluid transfer systems and protecting manufacturing yield.
online service
+86 592 625 8655-ext-622
carrie@xmbsl.com
carrielin36
+8613850062482
English
français
español
日本語
Tiếng việt
中文