AI + Drives the Upgrade of the Semiconductor Industry,and Baoshili Supports Advanced Processes with Material Innovation

"AI +" Drives the Upgrade of the Semiconductor Industry, and Baoshili Supports Advanced Processes with Material Innovation

2025-09-04

Recently, the State Council issued the Opinions on Further Implementing the "Artificial Intelligence +" Initiative, which provides policy guidance for promoting the in-depth integration of artificial intelligence (AI) with various fields of the economy and society, and brings new development opportunities for enterprises in the AI chip industry chain.

The Opinions propose to "strengthen the coordination of intelligent computing power and support the R&D and innovation of AI chips". It also supports the R&D of AI chips and the cultivation of enabling software ecosystems, accelerates the technological breakthroughs and engineering implementation of ultra-large-scale intelligent computing clusters, optimizes the layout of national intelligent computing resources, improves the national integrated computing power network, and gives full play to the role of national hubs of the "Eastern Data and Western Computing" project to enhance the coordination of resources such as data, computing, electricity, and networks. In addition, it emphasizes strengthening the interconnection and intercommunication of intelligent computing power and supply-demand matching, innovating the operation model of intelligent computing power infrastructure, encouraging the development of standardized and scalable computing power cloud services, and promoting the supply of intelligent computing power to be affordable and easy to use, cost-effective, green, and secure.

Amid this technological transformation, domestic enterprises are continuously deepening their efforts in their respective fields. As a national high-tech enterprise in the field of ultra-pure chemical packaging materials, Baoshili is advancing the localization process through technological innovation and providing ultra-clean supporting services for AI chip manufacturing.

01 Market Demand: Explosive Growth in Global AI Chip Demand

The rapid popularization of AI technology is driving explosive growth in the global AI chip market. Data released by research firm Omdia shows that the global market size of AI data center chips reached 123 billion US dollars in 2024, and will grow to 207 billion US dollars in 2025, with an annual growth rate of 67%. It is expected that by 2030, the total scale of this market will further expand to 286 billion US dollars.

The driving factors behind market growth include the widespread popularization of AI technology, the increase in the application of fine-tuning models, and the rising frequency of using inference models. These applications require strong computing power support during operation, which has driven the rapid growth of demand for AI chips.

02 Technological Breakthrough: Extreme Purity Requirements for Advanced Processes of AI Chips

The leap in AI chip performance highly depends on the progress of semiconductor manufacturing processes, and process miniaturization has put unprecedentedly strict requirements on all links.

Currently, mainstream AI training chips have adopted 5nm and more advanced processes, and are moving towards the 3nm node. As the size of transistors shrinks to the nanometer level, even the smallest contamination during the manufacturing process may lead to reduced chip performance or even failure. Advanced processes require wet electronic chemicals to meet Grade G4 and G5 standards, and the requirement for metal impurity content has been raised from ppb (parts per billion) to ppt (parts per trillion) level.

03 Industrial Collaboration: Baoshili Supports Chip Manufacturing with Ultra-Pure Materials

In the rapid development of the AI chip industry, Baoshili, as an upstream enterprise in the industrial chain, is providing ultra-pure packaging and transmission material products for the industrial chain through continuous technological innovation.

At present, Baoshili has successfully developed an ultra-pure chemical packaging material that meets the Grade G5 standard – the Ultra-Clean HDPE Drum (200L), which has entered the verification phase. Based on the excellent chemical stability and broad compatibility of HDPE, this product can be applied to various high-purity chemicals such as acids, alkalis, and organic chemicals. Through independent R&D technology, Baoshili has also introduced high-quality foreign raw materials and independently developed advanced production equipment, successfully developing semiconductor-grade Ultra-Clean PFA Tubes and Ultra-Clean PFA Connectors. Their excellent corrosion resistance and low metal ion leaching property meet the chemical transmission needs of advanced processes.

In the rapid development of the AI chip industry, Baoshili, as an upstream enterprise, is adding impetus to promoting the transformation of China's AI chip industry from "following" to "keeping pace" through continuous technological innovation.

Hot Tags : Ultra-Clean HDPE Drum Ultra-Clean PFA Tubes Ultra-Clean PFA Connectors

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