The global semiconductor industry is in a phase of profound transformation and accelerated innovation. The AI-driven surge in computing power, iteration of advanced packaging technologies, breakthroughs in heterogeneous integration, and reshaping of supply chain resilience are all painting a new landscape for future chip manufacturing. In this critical process, the purity, stability, and reliability of materials and consumables have become a vital foundation for supporting the leap of advanced processes and ensuring production yield. Against this backdrop, SEMICON Taiwan 2025 will grandly open on September 10th, and Baoshili (Booth No.: S8156) – a leading manufacturer of semiconductor-grade chemical packaging consumables in the industry – will participate in the exhibition.

As semiconductor manufacturing advances toward greater precision, complexity, and stringency, the purity and integrity of chemical delivery systems directly impact chip yield and performance. Baoshili has always been committed to providing global customers with high-standard and reliable solutions for chemical delivery consumables. At this exhibition, we will focus on showcasing innovative products such as ultra-pure fluorine materials, ultra-pure chemical packaging materials, and ultra-clean cloths.