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SEMICON JAPAN 2025 Grand Opening! Baoshili Showcases Cutting-Edge Products to Empower Advanced Semiconductor Manufacturing

2025-12-18

On December 17th, SEMICON JAPAN 2025, a flagship event of the Asian semiconductor industry, officially kicked off at the Tokyo International Exhibition Center. Gathering over 1,200 exhibitors from 35 countries and regions worldwide, as well as tens of thousands of industry professionals, the exhibition serves as a global platform to explore the future of the semiconductor industry. As a leading enterprise in China's ultra-clean technology sector, Baoshili (Booth No.: W1240) made its debut with cutting-edge products including ultra-pure fluorine materials, ultra-clean packaging materials, and cleanroom wipers, showcasing its professional, high-spec ultra-pure and ultra-clean solutions tailored for high-end semiconductor manufacturing processes.



With an unprecedented scale, this year's SEMICON JAPAN aims to delve into key industry topics such as sustainability, supply chain resilience, and industrial innovation. Baoshili's participation precisely targets the core areas of semiconductor manufacturing that demand extreme material purity and reliability. On-site, the company exhibited four product lines: Ultra-Clean PFA Tube, Ultra-Clean PFA Connector, Ultra-Clean HDPE Drum, and Cleanroom Wiper, attracting significant attention from global leading wafer fabrication plants, equipment suppliers, and industry technical experts.



A highlight of SEMICON JAPAN 2025 is the inaugural "AI × Sustainability × Semiconductor" (AIS) Summit, where representatives from global leading enterprises gathered to discuss the profound impact of artificial intelligence and sustainable development on the industry's future.This trend aligns closely with Baoshili's product R&D direction. As AI development imposes higher requirements on semiconductor processes, the upstream supply chain has set near-extreme standards for the purity of chemical material transfer and storage. Under such stringent purity demands, chemical packaging and transfer materials have become an integral part of the manufacturing process: they must possess ultra-high chemical inertness, ultra-low metal ion leaching rates (ppt level), and be produced and packaged entirely in ultra-clean environments—exactly the core technical field where Baoshili has deepened its expertise and achieved breakthroughs.



Through this exhibition, Baoshili not only intuitively demonstrated its professional technical strength and outstanding product performance to Asian customers but also gained in-depth insights into the latest local market needs and specific challenges through multiple one-on-one technical exchanges. The company looks forward to collaborating with more customers to address the challenges posed by the semiconductor industry's march toward more advanced processes, and is committed to becoming a trusted ultra-clean consumables manufacturer in the global high-end semiconductor manufacturing supply chain.


The exhibition will run until December 19th. Baoshili's booth (No.: W1240) warmly welcomes all visitors to attend and explore opportunities for cooperation!

 
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